Kulicke and Soffa designs and manufactures capital equipment for semiconductor assembly and packaging, most notably wire bonders used to connect chips to their packages. It also supplies tools and processes for advanced packaging, electronic assembly and related materials. Chipmakers and OSATs (outsourced assembly and test houses) are its core customers, so demand tracks semiconductor unit volumes and packaging technology shifts. The company is known for precision interconnect equipment rather than for designing the chips themselves.
| Quarter | Revenue | YoY % | Earnings | YoY % |
|---|---|---|---|---|
| Q2 2025 | 148.4 | — | -3.3 | — |
| Q3 2025 | 177.6 | — | 6.4 | — |
| Q4 2025 | 199.6 | — | 16.8 | — |
| Q1 2026 | 242.6 | — | 35.1 | — |
| Q2 2026 | 330.4 | 122.6% | 57.4 | — |
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